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| (R) EMIF04-MMC02F2 4 LINES EMI FILTER INCLUDING ESD PROTECTION IPADTM MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required: MultiMedia Card for mobile phones, Personal Digital Assistant, Digital Camera, MP3 players... DESCRIPTION The EMIF04-MMC02 is a highly integrated devices designed to suppress EMI/RFI noise for MultiMedia Card port. The EMIF04 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 1.57 mm x 2.07 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge) Flip-Chip (11 Bumps) Table 1: Order Code Part Number EMIF04-MMC02F2 Marking FH Figure 1: Pin Configuration (ball side) 3 I1 I2 I3 I4 2 O1 VD2 VD1 GND 1 A O2 O3 O4 B C D Figure 2: Configuration VD2 VD1 R20 R1 I1 I2 I3 I4 R4 R2 R3 R10 O1 (Data) O2 (CLK) O3 (CMD) O4 Cline = 20pF max. GND TM: IPAD is a trademark of STMicroelectronics. April 2005 REV. 2 1/7 EMIF04-MMC02F2 Table 2: Absolute Ratings (Tamb = 25C)) Symbol PR Tj Top Tstg Parameter and test conditions DC power per resistor Maximum junction temperature Operating temperature range Storage temperature range Value 70 125 - 40 to + 85 - 55 to + 150 Unit mW C C C Table 3: Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA VRM = 3V @ 0V Tolerance 5% Tolerance 5% Tolerance 5% 47 13 56 Min. 6 100 500 20 Typ. Max. Unit V nA pF k k Symbol VBR IRM Cline R1,R2,R3,R4 R10 R20 2/7 EMIF04-MMC02F2 Figure 3: S21 (dB) attenuation measurement and Aplac simulation EMIF04-MMC02F2: Aplac vs measurement (C3/C1 line) 0.00 dB - 5.00 - 10.00 Figure 4: Crosstalk measurements Xtalk measurements C3/B1 0.00 dB -10.00 -20.00 Simulation - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 Measurement -30.00 -40.00 -50.00 -60.00 - 40.00 - 45.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G -70.00 -80.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz 1.0G 3.0G Figure 5: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) Figure 6: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout) V(in) V(in) V(out) V(out) Figure 7: Junction capacitance versus reverse voltage applied (typical values) C(pF) 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VR(V) 2.5 3.0 3.5 4.0 F=1MHz Vosc=30mVRMS Tj=25C 3/7 EMIF04-MMC02F2 Figure 8: Aplac model device structure B2 C2 R20 R1 A3 R2 B3 C3 D3 MODEL = demif04 R3 R4 R10 A2 B1 C1 D1 MODEL = demif04 MODEL = demif04_gnd 120pH 100m D2 DEMIF04 BV = 7 IBV = 1m CJO = Cz M = 0.3333 RS = 1 VJ = 0.6 TT = 100n DEMIF04 gnd BV = 7 IBV = 1m CJO = Cz_gnd M = 0.3333 RS = 1 VJ = 0.6 TT = 100n Figure 9: Aplac model connections D2 Cins A3 Lbump Cins Rins Rbump B3 B1 Rins Cins Rins Rins Cins A2 R1 47 opt R2 47 R3 47 R4 47 R10 13k R20 56k Cz 15pF opt Cz_gnd 45pF opt Ls 450pH opt Rs 300m Rbump 50m Lbump 50pH lhole 940pH opt Rhole 100m cap_hole 0.15pF Cins 200fF Rins 10Meg Cins Rins Lhole cap_hole Rins Rhole Rins Cins C3 Cins C1 Rins Cins D1 D3 Rins Cins Rins Cins 4/7 EMIF04-MMC02F2 Figure 10: Order Code EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m = 3: Leadfree Pitch = 400m, Bump = 250m yy - xxx zz Fx Figure 11: FLIP-CHIP Package Mechanical Data 500m 50 315m 50 650m 65 500m 50 1.57mm 50m Figure 12: Foot Print Recommendations 2.07mm 50m Figure 13: Marking Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 545 400 545 Copper pad Diameter : 250m recommended , 300m max E Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 315m copper pad diameter xxz y ww 100 230 All dimensions in m 5/7 EMIF04-MMC02F2 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm Table 4: Ordering Information Ordering code EMIF04-MMC02F22 Marking FH Package Flip-Chip Weight 4.5 mg Base qty 5000 Delivery mode Tape & reel 7" Note: More packing informations are available in the application note AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 ST E ST E ST E xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 Table 5: Revision History Date 14-Oct-2004 06-Apr-2005 Revision 1 2 First issue. Minor layout update. No content change. Description of Changes 6/7 EMIF04-MMC02F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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